The Wi8i G2 Wafer Vision Inspection Handler is the latest advanced solution designed for 2D surface defect inspections and metrology.
Wi8i G2 features multiple handling mechanisms to support various wafer forms including raw wafers, hoop rings, and framed wafers ranging from 100mm (4”) to 300mm (12”).
It can replace conventional human manual visual inspection while providing inspection result data analysis and maintaining consistent, repeatable, and reproducibility inspection results.
Besides, it complements the existing process which has limited inspection capability with the latest product feature breakthrough such as the bottom surface inspection and Infrared (IR) inspection solution.
The bottom surface inspection is one of the Wi8i G2’s new technology. It enables the user to inspect the saw line and crack inspection through the wafer frame tape. With this new technology, the user can perform backside/bottom inspection for raw wafers under current defect capability at approximately 200μm gross defect. Also, it performs backside/Bottom Inspection on the frame wafer through tape inspection under current chipping captured at >15μm.

Industrial Instruments Division
Hollywood International Ltd.
Tel : (068) 788-8349, (02) 653-8555, (02) 653-8255, (02) 251-6032 (30 lines) ext. 710, 712, 715, 727, 728 or 729
E-mail: inds@hollywood.co.th
http://www.hollywood.co.th