Elevate Your WLCSP Inspection Capabilities with ViTrox VR20i G2

Enter a new era of semiconductor inspection with our innovative dual-camera system combining SWIR and NIR technologies for seamless Wafer Level Chip Scale Package (WLCSP) Inspection. This cutting-edge packaging technology enables electronic devices to be thinner and lighter while delivering enhanced performance.
 
While conventional vision systems can only inspect surface features, the VR20i G2's advanced camera system—combining SWIR (Short-Wave Infrared) and NIR (Near-Infrared)—penetrates silicon layers with unprecedented clarity. This capability allows the detection of hidden defects invisible to the naked eye, such as micro-cracks, delamination, or incomplete bonds. The system delivers up to 30% higher inspection accuracy compared to conventional systems. Our compact yet powerful system offers easy setup, real-time monitoring, and comprehensive data analysis. Fully compatible with Industry 4.0, it's the perfect solution for diverse industries including automotive, electronics, and defense sectors.
Ready to upgrade your inspection standards? Contact us today to experience the VR20i G2 difference.
 
Contact for more information at
Industrial Instruments Division
Hollywood International Ltd.
Tel :  02-653-8555, 02-653-8255, 02-251-6032 (30 lines) ต่อ 710, 712, 715, 720, 727, 728, 729
E-Mail :  inds@hollywood.co.th
www.hollywood.co.th