System | V510i SE | |
System Performances | ||
Inspection Functions | Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement | |
Board Level Tracebility | Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging | |
System Hardware | ||
Operating System | Windows 10 Pro (64 bit) | |
Optical Resolution & FOV Size | 12MP CoaXPress Camera Default: 60mmx45mm @ 15µm telecentric lens Option: 53mmx39mm @ 13µm telecentric lens Option: 32mmx24mm @ 8µm telecentric lens |
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Inspection Speed | 12MP @ 15μm resolution: up to 64cm²/sec | |
3D Technologies | Phase Shift Profilometry’s (PSP) Methodology with 4-way projectors | |
Lighting Module | Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module | |
Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA | |
PCB Dimension | ||
Maximum PCB Size (L x W) | FDL: 510mmx250mm (20”x9.8”) Single Lane: 510mmx540mm (20”x21.2”) |
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Minimum PCB Size (L x W) | 50mmx50mm (2”x2”) | |
Maximum PCB Inspectable Area (L x W) | FDL: 510mmx243mm (20”x9.5”) Single Lane: 510mmx533mm (20”x20.9”) |
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Maximum PCB Thickness | 4mm (0.16") | |
Minimum PCB Thickness | 0.5mm (0.02") | |
Maximum PCB Weight | 3KG | |
Top Clearance of PCB | 50mm | |
Bottom Clearance of PCB | 100mm | |
PCB Edge Clearance | 3.5mm | |
PCB Transport Height | 875mm-965mm | |
PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. | |
Installation Specification | ||
Power Supplies | 100-120 V, 16A / 200-240V, 8A Single Phase | |
Air requirement | N/A | |
System footprint (Width X Depth X Height) | 1060mmx1303mmx2000mm | |
Total system weight | ~830kgs |