V810Ai QX1

AI-Powered Smart 3D X-Ray Inspection for Advanced Electronics Manufacturing

The V810Ai QX1 is ViTrox's next-generation Smart 3D Automated X-ray Inspection (AXI) system, engineered to inspect today's most complex electronic assemblies with exceptional precision. Combining ultra-high-resolution X-ray imaging, AI-powered inspection technology, and advanced 3D reconstruction, the system delivers reliable detection of hidden defects throughout the entire manufacturing process—from New Product Introduction (NPI) to high-volume production.

Featuring imaging resolution of up to 2 μm, a 50° wide tomography angle, and Advanced Planar CT technology, the V810Ai QX1 provides accurate three-dimensional reconstruction of solder joints and internal structures. It enables manufacturers to detect defects that conventional optical inspection cannot identify, including Head-in-Pillow (HiP), voids, opens, shorts, lifted leads, Flip Chip packages, and System-in-Package (SiP) assemblies.

Key Features

• Ultra-high imaging resolution up to 2 μm for advanced semiconductor and microelectronics inspection
• AI-powered programming, defect detection, classification, and verification for higher productivity and reduced operator dependency
• Detects micro-defects down to 10 μm, ideal for Flip Chip, SiP, miniature electronics, and advanced packaging applications
• Advanced Planar CT technology for dual-sided PCB inspection with selective slice analysis
• Wide 50° tomography angle for superior 3D solder joint reconstruction and defect visibility
• High-speed precision imaging architecture for inline production without compromising inspection quality
• Smart factory ready with SMEMA and HERMES communication standards for seamless manufacturing integration

Ideal Applications

• Electronics Manufacturing Services (EMS)
• Semiconductor & Advanced Packaging
• Automotive Electronics
• Medical Electronics
• Telecommunications
• High-Reliability PCB Assembly