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  3. PX730i : Die Sorting & Vision Inspection Handler

PX730i : Die Sorting & Vision Inspection Handler

PX730i Designed for Die Sorting, Full 6 Sided Inspection and Tape & Reel Packaging, High Speed Waffle to Die sorting Tape and Reel Dual taping Inspection and Support Waffle Die Sorting Tray Output in One Machine.
Model Type PX730i
Wafer Input Type and Size
Film Frame Carrier - 6” to 12”

Round & Rectangular / Plastic & Metal Frame - 6” (150mm) , 8” (200mm) , 12” (300mm)

Wafer Cassette - 25“ x 8”, 13“ x 12”
UPH Sprint : 30K ; With Inspection : up to 24K
Sorting Index Time Down to 60ms
Device Size Range WLCSP & QFN: 0.8mm x 0.8mm; | Thickness ≥ 0.1mm
Process Flip Process, Non-flip Process
Input Wafer, Reel
Output Waffle Tray, Tape & Reel, Tape Width: 8mm, 12mm, 16mm
MTBA Typ. > 1 hr
MTBF Typ. > 168 hrs
Conversion Time Typ. < 45 mins
Input Voltage 415 VAC, 3 Phase, 50/60Hz
Compress Air 5 - 10 ±0.5 bar
Vacuum -0.5 ±0.1 bar
Dimension (LxWxH) 2450mm x 1920mm x 2000mm
Weight < 2500 kg
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