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V310i SE

System V310i SE
System Performances  
Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge.
Board Level Tracebility Camera-Read Barcodes; External Barcode Reader Configured
System Hardware 12MP 4MP
Operating System Windows 10 Pro (64 bit)
Optical Resolution & FOV Size Default: 60mmx45mm @ 15µm telecentric lens
Option: 53mmx39mm @ 13µm telecentric lens
Option: 32mmx24mm @ 8µm telecentric lens		 Default: 40mmx40mm @ 20µm telecentric lens
Inspection Speed 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec

12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec		 4MP CameraLink: 40~53cm²/sec
3D Technologies Phase Shift Profilometry’s (PSP) Methodology
Lighting Module Concurrent Lighting Module
Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
PCB Dimension SE FDL
Maximum PCB Size (L x W) 510mmx540mm (20”x21.2”) Single Lane: 510mmx450mm (20''x17.7'')
DL Equal: 510mmx250mm (20”x9.8”)
Minimum PCB Size (L x W) 50mmx50mm (2”x2”) 50mmx50mm (2”x2”)
Maximum PCB Inspectable Area (L x W) 510mmx533mm (20”x20.9”) Single Lane: 510mmx443mm (20''x17.4'')
DL Equal: 510mmx243mm (20”x9.5”)
Maximum PCB Thickness 4mm (0.16") 4mm (0.16")
Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02")
Maximum PCB Weight 3kg 3kg
Top Clearance of PCB 50mm 50mm
Bottom clearance of PCB 100mm 100mm
PCB Edge Clearance 3.5mm 3.5mm
PCB Transport Height 875mm-965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
Installation Specification  
Power Supplies 100-120 V, 16A/200-240V, 8A Single Phase
Air requirement N/A
System footprint (Width X Depth X Height) 1060mmx1303mmx2000mm
Total system weight ~830kgs
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