Hollywood International Ltd. › V510i Optimus 3D (for Advanced Packaging and Microelectronics)

V510i Optimus 3D (for Advanced Packaging and Microelectronics)

System	AOI for Advanced Packaging
System Performances
Component Defect Inspection Categories	Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate) Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc). Gold Pad/Finger Surface Inspection Foreign Material Detection Coordinates Measurement	Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate) Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc). Wire bond inspection: Missing Wire, Broken Wire, Sagging/Shifted Wire, Off Pad Bonding, Ball Bond Diameter, Shorted Wire, Wrong Bond Gold Pad/Finger Surface Inspection Foreign Material Detection Coordinates Measurement
Board Level Traceability	Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging
System Hardware	12MP	25MP
Operating System	Windows 10 (64-bit)
Optical Resolution & FOV Size	40mmx30mm @ 10μm telecentric lens 32mmx24mm @ 8µm telecentric lens	22.5mmx22.5mm @ 4.5μm telecentric lens
Inspection Speed	12MP CoaXPress @ 10μm resolution: 28-42cm²/sec 12MP CoaXPress @ 8μm resolution: 18-26cm²/sec	25MP CoaXPress @ 4.5μm resolution: 7-15cm²/sec
3D Technologies	True 3D Inspection with Phase Shift Profilometry’s (PSP) Methodology with 4-way projectors
Lighting Module	Built-in Coaxial Lighting Module, Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module
Conveyor Width Adjustment	Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA	Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
Board Dimension
Maximum Board Size (L x W)	490mmx510mm (19.2"x20")	470mmx500mm (18.5"x19.6")
Minimum Board Size (L x W)	50mmx50mm (2"x2")	50mmx50mm (2"x2")
Maximum Board Thickness	4mm (0.15")	4mm (0.15")
Minimum Board Thickness	0.2mm (0.00787")	0.2mm (0.00787")
Maximum PCB Weight	3kg	3kg
Top Clearance of PCB	35mm	10mm
Bottom clearance of PCB	70mm	70mm
PCB Edge Clearance	3.5mm	3.5mm
PCB Transport Height	875mm-965mm	875mm-965mm
PCB Temperature	Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.