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  3. V510i AOI for Advanced Packaging and Microelectronics

V510i AOI for Advanced Packaging and Microelectronics

Overview Next generation 3D AOI for advanced packaging that resolves challenging inspection with automation and flexibility.
 
Key Features
  1. 1. High speed performance 3D AOI system provides high accuracy and reliable inspection performance with real 3D measurement
  2. 2. High accuracy 3D inspection image for mirror components and reflective die
  3. 3. Unique test coverage for advanced packaging application (Lead frame inspection, die, and wire bond inspection) and mirror/reflective components
  4. 4. Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI)
  5. 5. Preferred choice of Top EMS Companies
  6. 6. Smart manufacturing ready

Specification

System Performances
Inspection Functions • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate)
• Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc).
• Gold Pad/Finger Surface Inspection
• Foreign Material Detection
• Coordinates Measurement		 • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate)
• Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc).
• Wire bond inspection: Missing Wire, Broken Wire, Sagging/Shifted Wire, Off Pad Bonding, Ball Bond Diameter, Shorted Wire, Wrong Bond
• Gold Pad/Finger Surface Inspection
• Foreign Material Detection
• Coordinates Measurement
Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging
System Hardware 25MP 25MP
Operating System Windows 10 (64-bit)
Optical Resolution & FOV Size * 44.2mm x 44.2mm @ 9μm telecentric lens
34.4mm x 34.4mm @ 7µm telecentric lens
29.5mm x 29.5mm @ 6µm telecentric lens		 24.6mm x 24.6mm @ 5μm telecentric lens
12.3mm x 12.3mm @ 2.5μm telecentric lens
Inspection Speed 25MP CoaXPress @ 9μm resolution: Up to 27.9cm²/sec
25MP CoaXPress @ 7μm resolution: Up to 16.9cm²/sec
25MP CoaXPress @ 6μm resolution: Up to 12.4cm²/sec		 25MP CoaXPress @ 5μm resolution: Up to 8.6cm²/sec
25MP CoaXPress @ 2.5μm resolution: Up to 2.2cm²/sec
3D Technologies True 3D Inspection with Phase Shift Profilometry (PSP) Methodology with 4-way projectors
Lighting Module Built-in Coaxial Lighting Module, Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module
Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
Board Dimension
Maximum Board Size (L x W) 490mm x 510mm (19.2" x 20") 470mm x 500mm (18.5" x 19.6")
Minimum Board Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2")
Maximum PCB Inspectable Area (L x W) 490mm x 503mm (19.3" x 19.8") 470mm x 493mm (18.5" x 19.4")
Maximum PCB Thickness 4mm (0.15") 4mm (0.15")
Minimum PCB Thickness 0.2mm (0.00787") 0.2mm (0.00787")
Maximum PCB Weight 3kg 3kg
Top Clearance of PCB 35mm 10mm
Bottom Clearance of PCB 70mm 70mm
PCB Edge Clearance 3.5mm 3.5mm
PCB Transport Height 890mm - 965mm
PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
Installation Specification
System Footprint (Width X Depth X Height) 1060mm x 1353mm x 2111mm
Total System Weight ~900kgs
Power Supplies 100-120V, 16A/200-240V, 8A Single Phase
Air Requirement 0.6 Mpa/85 psi
Remark * Based on system configuration.
Specifications are subject to change.
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