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  3. กล้องตรวจสอบ 3 มิติและ 5 ด้าน

กล้องตรวจสอบ 3 มิติและ 5 ด้าน

Vision Model
Vs3DLi Vs3DJLi
Vs3DTO Vs3DLiP
VsSiBtm VsPad
VsPP Vs5SPP
Vs3DBGAPP  

* Bottom view & 4 side views
* Under turret
* Optional for Position Checking
Descriptions
3D Lead 3D J Lead
3D Lead for TO Package 3D Lead with Bottom Package
Side Bottom Pad
Pad & Package 5S Pad & Package
3d Ball Grid Array & Package Inspection
 
Illustration

Lead Inspection

Lead (width, pitch, length, stand off) result by 3D & 5 Sided inspection Lead (length variance, span, sweep, skew) result by 3D & 5 Sided inspection Lead (maximum width, co-planarity, uncut tiebar) result by 3D & 5 Sided inspection
A. Lead Width
B. Lead Pitch
C. Stand Off
D. Lead Length		 E. Lead Length Variance
F. Span
G. Lead Sweep
H. Lead Skew		 I. Maximum Width
J. Co-planarity
K. Uncut Tiebar

Package Inspection

Package (incomplete mold, mold chipped off, scratches, mold flashes, void, crack, mold chipped off) by 3D & 5 Sided inspection
Package (Package width, package length, package thickness) by 3D & 5 Sided inspection

X: Package Width
Y: Package Length
Z: Package Thickness

Pad Inspection

Pad (Smear burr, bridging, solder melt, contamination, smear, offset, pad area, pad stand off) by 3D & 5 Sided inspection
Pad (Smear burr, bridging, solder melt, contamination, smear, offset, pad area, pad stand off) by 3D & 5 Sided inspection
Pad (Smear burr, bridging, solder melt, contamination, smear, offset, pad area, pad stand off) by 3D & 5 Sided inspection

A. Pad Width
B. Pad Length
C. Pad Offset
D. Pad Pitch
E. Missing Pad
F. Gap
G. Excess
H. Broken
I. Foreign Materials

*Solder Melt and Contamination are categorized as Broken in vision software.
**Smear, Burr and Bridging are categorized as Excess in vision software.
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