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V810i S3

System V810i S3
System controller Integrated controller with 8 Core Intel Xeon processors
Operating system Windows 10 Pro (64 bit)
Test Development Environment  
User interface Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels
Off-line test development software Optional for off-line PC
CAD conversion tool Support 4 different types of CAD in V810i software and optional software available to translate other CAD data to ViTrox's format
Typical test development time 4 hours to 1.5 days to convert raw CAD file and develop application
Line Integration  
Transport heights 865mm-1025mm
Line communication standard SMEMA, HERMES
Barcode readers Compatible with most industry standard barcode readers
Performance Parameters *  
False Call rate 500-1000ppm
Minimum features detection capability  
Joint pitch1 0.3mm and above
Short width2 0.045mm
Solder thickness 0.0127mm
Allowable Panel Characteristics ** V810i S3
Maximum PCB Size (L x W) 725mmx482.6mm (28.5"x19")
Minimum PCB Size (L x W) 63.5mmx63.5mm (2.5"x 2.5")
Maximum PCB inspectable area 725mmx474.9mm (28.5"x18.7")
Maximum PCB thickness 7mm (276 mils)
Minimum PCB thickness 0.5mm (20 mils)
PCB warp Downside < 3.3mm; Upside < 3.3mm
Maximum PCB weight 4.5kg
Top Clearance of PCB 50mm @ 22μm resolution
42mm @ 19μm resolution
26mm @ 15μm resolution
11mm @ 12μm resolution
26mm @ 10μm resolution
11mm @ 7μm resolution
(calculated from board top surface)
Bottom Clearance of PCB 80mm
PCB edge clearance 3mm
100% Press-fit testability Yes (With PSP2 / PSP2.1 feature)
PCB Temperature 40℃
Installation Specification  
Power Supplies 200–240 VAC three phase; 380–415 VAC three phase wye (+/- 5) (50Hz or 60Hz)
Air requirement 552kPA (80psi) compressed air
System footprint (Width X Depth X Height) 1835mmx2185mmx2162mm
Total system weight ~4800kgs
**Note:
1. Panels are handled on width edges. Panels with edge cut outs may require the use of a carrier.
2. Maximum panel size dimensions and weight must include carrier if applicable.
3. Smaller panels are possible with the use of panel carriers.
4. With panels of this thickness, imaging results can be affected by PCBA layout.
5. Measured from the bottom of the panel including a maximum warp.

*Note:
1. Assuming pad width is 50% of pitch.
2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board.

#2x2 binning camera configuration. Hardware upgrade is required on old system.
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